2 – Pole Filter for W - LAN B69812N2457A111 Preliminary Datasheet
Features
? Low Profile (maximum height 1.1 mm)
? SMD filter consisting of coupled resonators with stepped impedances
? Low Losses
? High attenuations at GSM (900, 1800) and UMTS bands
? High attenuation at 2 times center frequency
? (NdBa)TiO3 (εr = 88 / TC f =0±10 ppm/K) with a coating of copper (10μm) and tin (>5μm)
? Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2 ?Dimension Limits , Marking
? Recommended footprint
Page 3 ? Characteristics
? Maximum ratings
?Typical passband characteristic
Page 4 ? Processing information
? Soldering requirements
? Delivery mode
2 – Pole Filter for W - LAN B69812N2457A111 Preliminary Datasheet
Recommended footprint
Solder Pads:
I/O Pads must be
connected to lines with
50 ? im pedance.
In the application a
term ination of 50 ?
m ust be realized.
Ground, covered with
solder resist, connected
to low er ground plane
by vias w ith m aximum
diam eter of 0.3mm and
m ax. distance of 1mm
2 – Pole Filter for W - LAN
B69812N2457A111
Preliminary Datasheet
Characteristics (over whole temperature range)min. typ. max.
Center frequency f c - 2.450 - GHz
Insertion loss
αIL 1.3 1.5
dB Passband (2400- 2500)
B 100
MHz
Amplitude ripple (peak - peak) ?α
0.3 0.5 dB Standing wave ratio SWR
1.5
2.0 Impedance Z 50 ? Attenuation α
at DC to 827 MHz
at 827 to 960 MHz at 960 tp 1805 MHz at 1805 to 1910 MHz at 1910 to 1990 MHz at 1990 to 2100 MHz at 2100 to 2170 MHz at 3200 to 3500 MHz at 3500 to 4600 MHz at 4800 to 5000 MHz at 6000 to 7500 MHz
58
55
45
36
33
23
16
20
30
28
15
60 60 50 40 35 28 20 25 33 30 18 dB dB dB dB dB dB dB dB dB Maximum ratings
IEC climatic category (IEC 68-1) - 40 /+ 90/56 Operating temperature
T op - 40 / + 85
°C
Typical passband characteristics
2 – Pole Filter for W - LAN
B69812N2457A111
Preliminary Datasheet
Processing information
z Wettability to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic SnPb solder paste
Profile for leadfree solder paste
Soldering type reflow reflow
Maximum soldering temperature 235 (max. 2 sec.)260 (max. 2 sec.)°C (measuring point on top surface of the component)225 (max. 10 sec.) 250 (max. 10 sec.)°C
Recommended soldering conditions (infrared):
? Blister tape acc. to IEC 286-3, grey ? Pieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.